AIR STIRRER FOR FLAT PLATE PLATING

AIR STIRRER FOR FLAT PLATE PLATING

PURPOSE:To form plating layers having no differences in the thicknesses on both sides of a thin metallic sheet in the stage of subjecting the thin metallic sheet to electroplating by extending the bottom end of a supporting frame for the tin metallic sheet to the side lower than the top surface of b...

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Hauptverfasser: KOYAMA RYOHEI, KATONO TAKASHI
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Sprache:eng
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APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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creator KOYAMA RYOHEI
KATONO TAKASHI
description PURPOSE:To form plating layers having no differences in the thicknesses on both sides of a thin metallic sheet in the stage of subjecting the thin metallic sheet to electroplating by extending the bottom end of a supporting frame for the tin metallic sheet to the side lower than the top surface of bubble releasing pipes for stirring a plating liquid so that the bubbles ascend uniformly to both sides of the thin metallic sheet to uniformly stir the plating liquid even if the supporting frame inclines. CONSTITUTION:The thin metallic sheet 1 to be plated on both sides is attached to the supporting frame 3 and is connected by hangers 4 to a cathode electrode bar 5, then the sheet is suspended in the plating liquid 2. The lower part of the supporting frame 3 is so set that the bottom end of the frame 3 is positioned lower than the position of bubble releasing holes 7 of air bubble releasing pipes 6A, 6B for stirring. Air bubbles 8 are released from the holes 7. Gaseous H2 on the surface of the sheet 1 as the cathode is quickly removed and the plating liquid is uniformly stirred, by which the plating layers having a uniform thickness without pinholes are formed on both sides of the sheet 1. Even if the frame 3 inclines, the inclination is suppressed by the pipes 6A, 6B and the air bubbles 8 rise uniformly on both sides of the sheet 1. The stirring of the plating liquid and the removal of the gaseous H2 are normally executed.
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CONSTITUTION:The thin metallic sheet 1 to be plated on both sides is attached to the supporting frame 3 and is connected by hangers 4 to a cathode electrode bar 5, then the sheet is suspended in the plating liquid 2. The lower part of the supporting frame 3 is so set that the bottom end of the frame 3 is positioned lower than the position of bubble releasing holes 7 of air bubble releasing pipes 6A, 6B for stirring. Air bubbles 8 are released from the holes 7. Gaseous H2 on the surface of the sheet 1 as the cathode is quickly removed and the plating liquid is uniformly stirred, by which the plating layers having a uniform thickness without pinholes are formed on both sides of the sheet 1. Even if the frame 3 inclines, the inclination is suppressed by the pipes 6A, 6B and the air bubbles 8 rise uniformly on both sides of the sheet 1. The stirring of the plating liquid and the removal of the gaseous H2 are normally executed.</description><language>eng</language><subject>APPARATUS THEREFOR ; CHEMISTRY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; METALLURGY ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><creationdate>1987</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19870213&amp;DB=EPODOC&amp;CC=JP&amp;NR=S6233800A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19870213&amp;DB=EPODOC&amp;CC=JP&amp;NR=S6233800A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KOYAMA RYOHEI</creatorcontrib><creatorcontrib>KATONO TAKASHI</creatorcontrib><title>AIR STIRRER FOR FLAT PLATE PLATING</title><description>PURPOSE:To form plating layers having no differences in the thicknesses on both sides of a thin metallic sheet in the stage of subjecting the thin metallic sheet to electroplating by extending the bottom end of a supporting frame for the tin metallic sheet to the side lower than the top surface of bubble releasing pipes for stirring a plating liquid so that the bubbles ascend uniformly to both sides of the thin metallic sheet to uniformly stir the plating liquid even if the supporting frame inclines. 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CONSTITUTION:The thin metallic sheet 1 to be plated on both sides is attached to the supporting frame 3 and is connected by hangers 4 to a cathode electrode bar 5, then the sheet is suspended in the plating liquid 2. The lower part of the supporting frame 3 is so set that the bottom end of the frame 3 is positioned lower than the position of bubble releasing holes 7 of air bubble releasing pipes 6A, 6B for stirring. Air bubbles 8 are released from the holes 7. Gaseous H2 on the surface of the sheet 1 as the cathode is quickly removed and the plating liquid is uniformly stirred, by which the plating layers having a uniform thickness without pinholes are formed on both sides of the sheet 1. Even if the frame 3 inclines, the inclination is suppressed by the pipes 6A, 6B and the air bubbles 8 rise uniformly on both sides of the sheet 1. The stirring of the plating liquid and the removal of the gaseous H2 are normally executed.</abstract><oa>free_for_read</oa></addata></record>
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subjects APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
title AIR STIRRER FOR FLAT PLATE PLATING
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