AIR STIRRER FOR FLAT PLATE PLATING

PURPOSE:To form plating layers having no differences in the thicknesses on both sides of a thin metallic sheet in the stage of subjecting the thin metallic sheet to electroplating by extending the bottom end of a supporting frame for the tin metallic sheet to the side lower than the top surface of b...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KOYAMA RYOHEI, KATONO TAKASHI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PURPOSE:To form plating layers having no differences in the thicknesses on both sides of a thin metallic sheet in the stage of subjecting the thin metallic sheet to electroplating by extending the bottom end of a supporting frame for the tin metallic sheet to the side lower than the top surface of bubble releasing pipes for stirring a plating liquid so that the bubbles ascend uniformly to both sides of the thin metallic sheet to uniformly stir the plating liquid even if the supporting frame inclines. CONSTITUTION:The thin metallic sheet 1 to be plated on both sides is attached to the supporting frame 3 and is connected by hangers 4 to a cathode electrode bar 5, then the sheet is suspended in the plating liquid 2. The lower part of the supporting frame 3 is so set that the bottom end of the frame 3 is positioned lower than the position of bubble releasing holes 7 of air bubble releasing pipes 6A, 6B for stirring. Air bubbles 8 are released from the holes 7. Gaseous H2 on the surface of the sheet 1 as the cathode is quickly removed and the plating liquid is uniformly stirred, by which the plating layers having a uniform thickness without pinholes are formed on both sides of the sheet 1. Even if the frame 3 inclines, the inclination is suppressed by the pipes 6A, 6B and the air bubbles 8 rise uniformly on both sides of the sheet 1. The stirring of the plating liquid and the removal of the gaseous H2 are normally executed.