PATTERN READING DEVICE FOR WAFER

PURPOSE:To realize a small-size illuminating device, by constituting with a stage to mount a wafer, a light emitting element array to illuminate a part of the wafer, the driving means to scan the illuminated part of the wafer, and an image pick-up element array. CONSTITUTION:A part of a wafer 3 moun...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: AKAGAWA KATSUYUKI
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator AKAGAWA KATSUYUKI
description PURPOSE:To realize a small-size illuminating device, by constituting with a stage to mount a wafer, a light emitting element array to illuminate a part of the wafer, the driving means to scan the illuminated part of the wafer, and an image pick-up element array. CONSTITUTION:A part of a wafer 3 mounted on a stage 1 is illuminated by a scattered light (c) of a light emitting element array 4. This part is read by a image pick-up element array 6 through a lens 5. As for the image puck-up element array 6 which reads the pattern of a wafer 3, a plurality of solid state image pick-up elements are arranged in a row nearly parallel to the direction along which a plurality of solid state light emitting array 8 is arranged, so that one line of pattern of the wafer 3 is read. A driving equipment 2 moves a stage 1 in the direction nearly perpendicular to the direction along which a plurality of solid state light emitting element 8 is arranged, while the image pick-up element array 6 reads the pattern of the wafer 3 row by row. In the course of this traveling, a light emitting element array 4 illuminates the whole part of the wafer 3 so that the image pick-up element array 6 may read the whole part of the wafer 3.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JPS6232624A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JPS6232624A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JPS6232624A3</originalsourceid><addsrcrecordid>eNrjZFAIcAwJcQ3yUwhydXTx9HNXcHEN83R2VXDzD1IId3RzDeJhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfFeAcFmRsZGZkYmjsZEKAEAqK8hkw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>PATTERN READING DEVICE FOR WAFER</title><source>esp@cenet</source><creator>AKAGAWA KATSUYUKI</creator><creatorcontrib>AKAGAWA KATSUYUKI</creatorcontrib><description>PURPOSE:To realize a small-size illuminating device, by constituting with a stage to mount a wafer, a light emitting element array to illuminate a part of the wafer, the driving means to scan the illuminated part of the wafer, and an image pick-up element array. CONSTITUTION:A part of a wafer 3 mounted on a stage 1 is illuminated by a scattered light (c) of a light emitting element array 4. This part is read by a image pick-up element array 6 through a lens 5. As for the image puck-up element array 6 which reads the pattern of a wafer 3, a plurality of solid state image pick-up elements are arranged in a row nearly parallel to the direction along which a plurality of solid state light emitting array 8 is arranged, so that one line of pattern of the wafer 3 is read. A driving equipment 2 moves a stage 1 in the direction nearly perpendicular to the direction along which a plurality of solid state light emitting element 8 is arranged, while the image pick-up element array 6 reads the pattern of the wafer 3 row by row. In the course of this traveling, a light emitting element array 4 illuminates the whole part of the wafer 3 so that the image pick-up element array 6 may read the whole part of the wafer 3.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MEASURING ; MEASURING ANGLES ; MEASURING AREAS ; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS ; MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS ; PHYSICS ; SEMICONDUCTOR DEVICES ; TESTING</subject><creationdate>1987</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19870212&amp;DB=EPODOC&amp;CC=JP&amp;NR=S6232624A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19870212&amp;DB=EPODOC&amp;CC=JP&amp;NR=S6232624A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>AKAGAWA KATSUYUKI</creatorcontrib><title>PATTERN READING DEVICE FOR WAFER</title><description>PURPOSE:To realize a small-size illuminating device, by constituting with a stage to mount a wafer, a light emitting element array to illuminate a part of the wafer, the driving means to scan the illuminated part of the wafer, and an image pick-up element array. CONSTITUTION:A part of a wafer 3 mounted on a stage 1 is illuminated by a scattered light (c) of a light emitting element array 4. This part is read by a image pick-up element array 6 through a lens 5. As for the image puck-up element array 6 which reads the pattern of a wafer 3, a plurality of solid state image pick-up elements are arranged in a row nearly parallel to the direction along which a plurality of solid state light emitting array 8 is arranged, so that one line of pattern of the wafer 3 is read. A driving equipment 2 moves a stage 1 in the direction nearly perpendicular to the direction along which a plurality of solid state light emitting element 8 is arranged, while the image pick-up element array 6 reads the pattern of the wafer 3 row by row. In the course of this traveling, a light emitting element array 4 illuminates the whole part of the wafer 3 so that the image pick-up element array 6 may read the whole part of the wafer 3.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MEASURING</subject><subject>MEASURING ANGLES</subject><subject>MEASURING AREAS</subject><subject>MEASURING IRREGULARITIES OF SURFACES OR CONTOURS</subject><subject>MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1987</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFAIcAwJcQ3yUwhydXTx9HNXcHEN83R2VXDzD1IId3RzDeJhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfFeAcFmRsZGZkYmjsZEKAEAqK8hkw</recordid><startdate>19870212</startdate><enddate>19870212</enddate><creator>AKAGAWA KATSUYUKI</creator><scope>EVB</scope></search><sort><creationdate>19870212</creationdate><title>PATTERN READING DEVICE FOR WAFER</title><author>AKAGAWA KATSUYUKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPS6232624A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1987</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MEASURING</topic><topic>MEASURING ANGLES</topic><topic>MEASURING AREAS</topic><topic>MEASURING IRREGULARITIES OF SURFACES OR CONTOURS</topic><topic>MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>AKAGAWA KATSUYUKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>AKAGAWA KATSUYUKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PATTERN READING DEVICE FOR WAFER</title><date>1987-02-12</date><risdate>1987</risdate><abstract>PURPOSE:To realize a small-size illuminating device, by constituting with a stage to mount a wafer, a light emitting element array to illuminate a part of the wafer, the driving means to scan the illuminated part of the wafer, and an image pick-up element array. CONSTITUTION:A part of a wafer 3 mounted on a stage 1 is illuminated by a scattered light (c) of a light emitting element array 4. This part is read by a image pick-up element array 6 through a lens 5. As for the image puck-up element array 6 which reads the pattern of a wafer 3, a plurality of solid state image pick-up elements are arranged in a row nearly parallel to the direction along which a plurality of solid state light emitting array 8 is arranged, so that one line of pattern of the wafer 3 is read. A driving equipment 2 moves a stage 1 in the direction nearly perpendicular to the direction along which a plurality of solid state light emitting element 8 is arranged, while the image pick-up element array 6 reads the pattern of the wafer 3 row by row. In the course of this traveling, a light emitting element array 4 illuminates the whole part of the wafer 3 so that the image pick-up element array 6 may read the whole part of the wafer 3.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_JPS6232624A
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MEASURING
MEASURING ANGLES
MEASURING AREAS
MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
title PATTERN READING DEVICE FOR WAFER
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-30T01%3A38%3A17IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=AKAGAWA%20KATSUYUKI&rft.date=1987-02-12&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJPS6232624A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true