SEMICONDUCTOR DEVICE

PURPOSE:To improve the working efficiency by fusionbonding thermal stress buffer plates to electrodes to be integrated to prevent the plates from being displaced, and reducing the number of components to be assembled as a semiconductor device. CONSTITUTION:Thermal stress buffer plates 2a, 3a interposed between a semiconductor element 1 and the anode and cathode electrodes 4, 5 are respectively integrated with the electrodes 4, 5 by brazing or simultaneous rolling, and used as anode and cathode electrode assemblies 4A, 5A. Thus, the electrode assemblies in which the plates are integrated are used to prevent the plates from being displaced with respect to the element 1, thereby always applying a uniform pressurizing stress to the element 1. Since the plates 2a, 3a having similar thermal expansion coefficient to that of the element 1 are contacted with the element 1, a thermal stress applied to the element 1 can be reduced.