DIE BONDING OF SEMICONDUCTOR CHIP

PURPOSE:To enable positioning of a semiconductor chip to be easily performed without an expensive device being needed and with high dimensional accuracy and repeatability, by forming four slant planes on the surface of a substrate for mounting a semiconductor chip so that they correspond to four sides of the bottom plane of the semiconductor chip and then performing position alignment of the semiconductor chip by using these slant planes. CONSTITUTION:Four slant planes 12 corresponding to four sides of the bottom plane of a semiconductor chip 13 are formed on the surface of a substrate 11 for mounting the semiconductor chip 13, and position alignment of the semiconductor chip 13 is performed by using these slant planes. For example, the said four slant planes 12 are formed in recessed shapes on the surface of the substrate 13, and the substrate surface inside the four slant planes 12, that is, the recessed bottom plane generated by forming the slant planes 12 is coated with an adhesive 14, with the semiconductor chip 13 mounted thereon. The semiconductor chip 13 is then pressed from above so that the four sides of the bottom plane of the semiconductor chip 13 is brought in contact with the four slant planes 12 to perform the positioning of the semiconductor chip 13. Thereafter, the adhesive 14 is hardened to fix the semiconductor 13 with the substrate 11, and electrodes on the surface of the semiconductor chip 13 are connected with the wiring pattern on the surface of the substrate 11.