FERROUS ALLOY FOR SEMICONDUCTOR DEVICE LEAD

PURPOSE:To manufacture the titled ferrous alloy causing problem of thermal expansion neither to semiconductor device nor to seal resin and having high strength, by limiting respective contents of C, O, N, P, S, Si, Mn, etc., in a stainless steel containing specific amounts of Cr. CONSTITUTION:The fe...

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Bibliographische Detailangaben
Hauptverfasser:	TSUJI MASAHIRO, TOE TAMIO
Format:	Patent
Sprache:	eng
Schlagworte:	ALLOYS BASIC ELECTRIC ELEMENTS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS METALLURGY SEMICONDUCTOR DEVICES TREATMENT OF ALLOYS OR NON-FERROUS METALS
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Beschreibung
Zusammenfassung:	PURPOSE:To manufacture the titled ferrous alloy causing problem of thermal expansion neither to semiconductor device nor to seal resin and having high strength, by limiting respective contents of C, O, N, P, S, Si, Mn, etc., in a stainless steel containing specific amounts of Cr. CONSTITUTION:The ferrous alloy has a composition consisting of, by weight, >30-40% Cr,