EPOXY RESIN POWDER COATING COMPOSITION

PURPOSE:To provide the title compsn. having excellent flexibility, adhesion and resistance to water and boiling water, consisting of a specified poly(di) glycidyl ether compsn. and a curing agent for epoxy resin. CONSTITUTION:An epoxy resin of formula I (wherein n is a number of 0-3) is reacted with...

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Bibliographische Detailangaben
Hauptverfasser:	ISHIZAKI NORITOSHI, YAMAMOTO YOUJIROU, KOBAYASHI YOSHIKAZU
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON CORRECTING FLUIDS DYES FILLING PASTES INKS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	PURPOSE:To provide the title compsn. having excellent flexibility, adhesion and resistance to water and boiling water, consisting of a specified poly(di) glycidyl ether compsn. and a curing agent for epoxy resin. CONSTITUTION:An epoxy resin of formula I (wherein n is a number of 0-3) is reacted with bisphenol A, etc. in the presence of a catalyst (e.g., a tert. amine) at 50-140 deg.C for 2-5hr to obtain a poly(di)glycidyl ether compd. (A) having a 4,4'-bis-3,3'-5,5'-tetramethylbiphenol skeleton introduced thereinto and an average MW of not lower than 900, represented by formulas II and/or III (wherein X is H or halogen; Y is H or CH3; and l, m and n are each not smaller than 0). The component A is blended with a curing agent (B) (e.g., a phenolic novolak) for epoxy resin and optionally a filler (e.g., TiO2), a colorant, a curing accelerator, a thixotropic agent, a flow modifier, etc. (C). The mixture is melt- kneaded at 70-140 deg.C, cooled and crushed.