DIE-BONDING METHOD FOR SEMICONDUCTOR ELEMENT

PURPOSE:To maintain insulation between each of semiconductor elements, by mounting semiconductors on a die-bonding pad by using a conductive adhesive and a non-conductive one. CONSTITUTION:A conductive adhesive 3 and a non-conductive one 4 are applied by a dispensing method on a die-bonding pad 2 in...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SUWA TOSHIKO, ARAO YOSHINORI, IGUCHI YASUO, TOKURA KAZUO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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