DIE-BONDING METHOD FOR SEMICONDUCTOR ELEMENT

PURPOSE:To maintain insulation between each of semiconductor elements, by mounting semiconductors on a die-bonding pad by using a conductive adhesive and a non-conductive one. CONSTITUTION:A conductive adhesive 3 and a non-conductive one 4 are applied by a dispensing method on a die-bonding pad 2 in the manner that a non- conductive adhesive parts 4 are formed on the side terminal parts of the conductive adhesive parts 3, and die-bonding of a semiconductor element 5 is performed thereon. Though the pressure of the die-bonding allows the adhesives to be swelled out, insulation between each of the semiconductor elements can be maintained without the conductive adhesive being short-circuited due to the non-conductive adhesive existing at the terminal parts of the semiconductor element 5.