THERMOSETTING AND BONDING COMPOSITION

PURPOSE:The titled composition, containing an epoxy resin, COOH group- containing acrylonitrile-butadiene copolymer, synthetic rubber and terpene phenolic resin in a specific proportion, having tackiness at ordinary temperature and curable without deteriorating cohesive force in heating. CONSTITUTIO...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YANAGISAWA SEIICHI, DOBASHI TOMOAKI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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