THERMOSETTING AND BONDING COMPOSITION

PURPOSE:The titled composition, containing an epoxy resin, COOH group- containing acrylonitrile-butadiene copolymer, synthetic rubber and terpene phenolic resin in a specific proportion, having tackiness at ordinary temperature and curable without deteriorating cohesive force in heating. CONSTITUTIO...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	YANAGISAWA SEIICHI, DOBASHI TOMOAKI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PURPOSE:The titled composition, containing an epoxy resin, COOH group- containing acrylonitrile-butadiene copolymer, synthetic rubber and terpene phenolic resin in a specific proportion, having tackiness at ordinary temperature and curable without deteriorating cohesive force in heating. CONSTITUTION:A composition containing (A) 100pts.wt. epoxy resin, preferably polycondensate of bisphenol with epichlorohydrin, (B) 3-15pts.wt. COOH group- containing acrylonitrile-butadiene copolymer, (C) 60-100pts.wt. synthetic rubber, preferably styrene-butadiene rubber, nitrile rubber, chloroprene rubber, vinylpyridine rubber, butyl rubber or polysulfide rubber and (D) 20-90pts.wt. terpene phenolic resin.