PLATED STEEL SHEET HAVING PLATED LAYER WITH SUPERIOR ADHESION

PLATED STEEL SHEET HAVING PLATED LAYER WITH SUPERIOR ADHESION

PURPOSE:To provide superior adhesion to a plated layer on a steel sheet by previously forming a plated layer contg. a specified amount of one or more among Cu, Ni, Co, Cr and Mo as the lowest layer on the surface of the steel sheet contg. a specified amount of one or more among Cu, Ni, Cr and Mo. CO...

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Hauptverfasser: AZAMI TADAO, MITSUYOSHI YASUHIKO, HANEDA TAKASHI
Format: Patent
Sprache:eng
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APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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creator AZAMI TADAO
MITSUYOSHI YASUHIKO
HANEDA TAKASHI
description PURPOSE:To provide superior adhesion to a plated layer on a steel sheet by previously forming a plated layer contg. a specified amount of one or more among Cu, Ni, Co, Cr and Mo as the lowest layer on the surface of the steel sheet contg. a specified amount of one or more among Cu, Ni, Cr and Mo. CONSTITUTION:A plated layer contg. one or more among Cu, Ni, Co, Cr and Mo is formed as the lowest layer on the surface of a steel sheet contg. 0.1-5% one or more among, Cu, Ni, Cr and Mo.
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subjects APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
title PLATED STEEL SHEET HAVING PLATED LAYER WITH SUPERIOR ADHESION
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