PLATED STEEL SHEET HAVING PLATED LAYER WITH SUPERIOR ADHESION

PURPOSE:To provide superior adhesion to a plated layer on a steel sheet by previously forming a plated layer contg. a specified amount of one or more among Cu, Ni, Co, Cr and Mo as the lowest layer on the surface of the steel sheet contg. a specified amount of one or more among Cu, Ni, Cr and Mo. CO...

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Bibliographische Detailangaben
Hauptverfasser:	AZAMI TADAO, MITSUYOSHI YASUHIKO, HANEDA TAKASHI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:	PURPOSE:To provide superior adhesion to a plated layer on a steel sheet by previously forming a plated layer contg. a specified amount of one or more among Cu, Ni, Co, Cr and Mo as the lowest layer on the surface of the steel sheet contg. a specified amount of one or more among Cu, Ni, Cr and Mo. CONSTITUTION:A plated layer contg. one or more among Cu, Ni, Co, Cr and Mo is formed as the lowest layer on the surface of a steel sheet contg. 0.1-5% one or more among, Cu, Ni, Cr and Mo.