ULTRASONIC SOLDERING DEVICE

PURPOSE:To improve the durable performance by forming a soldering ultrasonic chip in the sintered body containing the specified percentage of the ZrB2 which is more than one kind of Cr, Mo, W boride and replaces one part thereof at the specified percentage with more than one kind of a ferrous metal....

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: NOMAKI KOJI, HAMASHIMA KAZUO
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PURPOSE:To improve the durable performance by forming a soldering ultrasonic chip in the sintered body containing the specified percentage of the ZrB2 which is more than one kind of Cr, Mo, W boride and replaces one part thereof at the specified percentage with more than one kind of a ferrous metal. CONSTITUTION:The ultrasonic chip 1 for soldering is made by the sintered body of the powder containing 50-70wt% ZrB2 which is more than one kind of the boride of Cr, Mo or W and replaces one part thereof at 3-55wt%. In this case, the W containing weight is taken at 0.5