INSPECTING METHOD FOR CIRCUIT BOARD

PURPOSE:To eliminate damage to an electrode to be measured and to perform inspection securely even if a circuit board is curved or strained by pressing an elastic body against a flexible substrate for measurement and thus bringing the substrate into contact with the electrode to be measured. CONSTITUTION:The substrate 3 is positioned above the circuit board 1 while a proper gap D is left, and the electrode 2 to be measured on the circuit board 1 and the measurement electrode 5 on the substrate 3 for measurement are positioned opposite each other by using a microscope 9. While the substrate 3 for measurement is stopped, a pressure piece is pushed and moved by a pushing means which is not shown in a figure to press the position where the measurement electrode 5 of the substrate 3 for measurement toward the circuit board 1 across the elastic body 7. Then, the arrangement position of the measurement electrode 5 of the substrate 3 for measurement is pushed by the pressure piece 8 across the elastic body 7 and displace toward the circuit board 1, and the measurement electrode 5 contacts the electrode 2 to be measured to obtain mutual conduction, thereby performing the specific inspection of the circuit board 1.