EPOXY RESIN COMPOSITION

PURPOSE:To obtain the titled composition which is excellent in flow, has a controllable curing rate and can give a cured article excellent in electrical and mechanical properties and low in a shrinkage, by mixing an epoxy resin with an acid anhydride, a specified curing catalyst, a fiber and an inor...

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Bibliographische Detailangaben
Hauptverfasser: KAO MIN TAI, SUZUKI SHIYUICHI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PURPOSE:To obtain the titled composition which is excellent in flow, has a controllable curing rate and can give a cured article excellent in electrical and mechanical properties and low in a shrinkage, by mixing an epoxy resin with an acid anhydride, a specified curing catalyst, a fiber and an inorganic fiber. CONSTITUTION:100pts.wt. epoxy resin (A) (e.g., aliphatic epoxy resin) is mixed with 20-150pts.wt. curing catalyst (C) comprising an organoaluminum compound (a) and an organosilicon compound (b) having a Si-bonded hydroxyl group and/or a Si-bonded hydrolyzable group in the molecule, in an amount to provide an (a) to (b) ratio of 10-1/1-20, a fiber (D) (e.g., glass fiber) having a diameter of 1-20mum and an average length of 3-300mum and an inorganic powder (E) (e.g., silica) having an average particle diameter of 0.2-10mum in an amount to provide a total of components D and E of 30-65vol%, based on the obtained composition and a volume ratio of D to E of 0.3-0.8.