MAGNETIC HEAD ASSEMBLY

PURPOSE:To reduce the thickness of a magnetic head where an integrated circuit is mounted and to reduce its size by arranging the main integrated circuit body in the hollow hole of a magnetic head support body and sticking the magnetic head support body and a printed wiring board one over the other,...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SHIMIZU KOICHI, KARAKAMA YOSHIAKI
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:PURPOSE:To reduce the thickness of a magnetic head where an integrated circuit is mounted and to reduce its size by arranging the main integrated circuit body in the hollow hole of a magnetic head support body and sticking the magnetic head support body and a printed wiring board one over the other, and connecting terminals led out of the main integrated circuit body to conductor foil on the wiring board in a plane. CONSTITUTION:The magnetic head 1 is fitted to the magnetic head support body (arm) 2, the board 5 which has a hole 4 a little bit smaller than the hole 3 of the arm 2 is stuck, and the conductor foil 8 is further stuck thereupon. The main integrated circuit body 6 is inserted into and embedded completely in the hole formed of those holes 3 and 4 and the terminals 7 led out of the main integrated circuit body 6 are connected to the conductor foil 8 in a plane by soldering 9. Consequently, the thickness of the magnetic head assembly is the size 12d from the head of the solder 9 to the bottom of the arm 2 and the size of the magnetic disk device is reducible.