APPARATUS FOR SUPPLYING DIE BONDING RESIN IN SEMICONDUCTOR MANUFACTURING APPARATUS

APPARATUS FOR SUPPLYING DIE BONDING RESIN IN SEMICONDUCTOR MANUFACTURING APPARATUS

PURPOSE:To make it possible to apply a resin over a wide area without waste by providing a resin coating head having an area wider than the diameter of the needle of a dispensing system to the leading end of the needle. CONSTITUTION:A die bonding resin 1 is received in a syringe 2 and a coating head...

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1. Verfasser: YAGOURA HIDEYA
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APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL
APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
PERFORMING OPERATIONS
SPRAYING OR ATOMISING IN GENERAL
TRANSPORTING
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creator YAGOURA HIDEYA
description PURPOSE:To make it possible to apply a resin over a wide area without waste by providing a resin coating head having an area wider than the diameter of the needle of a dispensing system to the leading end of the needle. CONSTITUTION:A die bonding resin 1 is received in a syringe 2 and a coating head 9 is mounted to the leading end part of the syringe 2 through a needle 3. Because the under surface of the coating head 9 has an area wider than the cross-sectional area of the needle and is formed into a shape capable of obtaining a desired emitting state, the resin is applied over a wide area of a die pad part 8 in a proper amount and shape. A resin containing a volatile component can also be used and the application of the resin to an uneven coating part becomes possible.
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subjects APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL
APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
PERFORMING OPERATIONS
SPRAYING OR ATOMISING IN GENERAL
TRANSPORTING
title APPARATUS FOR SUPPLYING DIE BONDING RESIN IN SEMICONDUCTOR MANUFACTURING APPARATUS
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