APPARATUS FOR SUPPLYING DIE BONDING RESIN IN SEMICONDUCTOR MANUFACTURING APPARATUS

PURPOSE:To make it possible to apply a resin over a wide area without waste by providing a resin coating head having an area wider than the diameter of the needle of a dispensing system to the leading end of the needle. CONSTITUTION:A die bonding resin 1 is received in a syringe 2 and a coating head...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	YAGOURA HIDEYA
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL PERFORMING OPERATIONS SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PURPOSE:To make it possible to apply a resin over a wide area without waste by providing a resin coating head having an area wider than the diameter of the needle of a dispensing system to the leading end of the needle. CONSTITUTION:A die bonding resin 1 is received in a syringe 2 and a coating head 9 is mounted to the leading end part of the syringe 2 through a needle 3. Because the under surface of the coating head 9 has an area wider than the cross-sectional area of the needle and is formed into a shape capable of obtaining a desired emitting state, the resin is applied over a wide area of a die pad part 8 in a proper amount and shape. A resin containing a volatile component can also be used and the application of the resin to an uneven coating part becomes possible.