PRODUCTION OF DISPERSION OF FINE HEAT-RESISTANT RESIN PARTICLE

PURPOSE:To obtain the titled dispersion, having a relatively narrow distribution of resin particle diameter and improved solvent resistance, slipperiness, electrical characteristic, etc., and useful as an improver for heat resistance, moldability, etc., by polymerizing a polymerizable monomer contai...

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Bibliographische Detailangaben
Hauptverfasser: FUJIWARA TERUAKI, TAKEHARA HIDETOSHI, TAKIYAMA KEIICHI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PURPOSE:To obtain the titled dispersion, having a relatively narrow distribution of resin particle diameter and improved solvent resistance, slipperiness, electrical characteristic, etc., and useful as an improver for heat resistance, moldability, etc., by polymerizing a polymerizable monomer containing a maleimide compound by an emulsion or suspension polymerization method. CONSTITUTION:A polymerizable monomer containing a maleimide compound expressed by the formula [R1 and R2 are H, halogen, 1-15C alkyl or (substituted) aryl; R3 is H, 1-15C alkyl, cycloalkyl or (substituted) aryl], e.g. N-ethylmaleimide, etc., is polymerized in the presence of an emulsifying agent, e.g. sodium lauryl sulfate, etc., or suspending agent, e.g. polyvinyl alcohol (PVA), etc., using a polymerizing initiator normally in an inert gas atmosphere to afford the aimed dispersion having normally 0.01-100mu resin particle diameter. The above-mentioned polymerizable monomer preferably contains a compound expressed by the formula as a principal component together with another monomer, e.g. methyl methacrylate, etc.