STRIKE PLATING METHOD FOR TUNGSTEN WIRE

PURPOSE:To obtain a strike plating film having good adhesiveness in a short period by subjecting a W wire to plating in an Ni strike bath under specific high current density conditions. CONSTITUTION:The W wire is subjected to plating at 70-130A/dm current density by using the Ni strike bath consisti...

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Hauptverfasser:	ISHIMARU AKIRA, TOUGOU TOORU, WATAYA KENJI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:	PURPOSE:To obtain a strike plating film having good adhesiveness in a short period by subjecting a W wire to plating in an Ni strike bath under specific high current density conditions. CONSTITUTION:The W wire is subjected to plating at 70-130A/dm current density by using the Ni strike bath consisting of NiCl2 and hydrochloric acid, etc. The adhesiveness to the wire material is improved and the plating film which excels in both the adhesiveness and appearance is eventually formed even if the Ni plating film is subjected to objective gold plating, etc., thereon.