LEAD FRAME FOR SEMICONDUCTOR DEVICE

PURPOSE:To omit a conventional coated film for a lead frame, by making the wire bonding part of the lead frame to be amorphous. CONSTITUTION:The main body of a lead frame 3 is made of Fe-Ni alloy, Cu alloy, Cu and Fe alloy. In order to form an amorphous body at a part for bonding pieces of wire 5, t...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KANEHIRO KAZUO, IGARASHI TADASHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!