EPOXY RESIN COMPOSITION

PURPOSE:An epoxy composition, consisting of an epoxy resin, formimidate compound, organosilicon compound and organic complex compound, having excellent storage stability and improved quick-curing properties as a two-pack type composition and useful as adhesives, coating materials, etc. CONSTITUTION:...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	KIHARA NAOKO, SUZUKI SHIYUICHI
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PURPOSE:An epoxy composition, consisting of an epoxy resin, formimidate compound, organosilicon compound and organic complex compound, having excellent storage stability and improved quick-curing properties as a two-pack type composition and useful as adhesives, coating materials, etc. CONSTITUTION:An epoxy resin composition consisting of (A) 100pts.wt. com pound having >=1 epoxy groups, (B) 0.01-60pts.wt. compound having >=1 formimidate groups, e.g. methyl N-phenylformimidate or diphenyl N- hexylformimidate, (C) 0.0001-20pts.wt., preferably 0.01-10pts.wt. organosilicon compound having silanol group or producing silanol group, (D) 0.001-10pts.wt., preferably 0.01-5pts.wt. organic complex compound, preferably an organoaluminum complex, and preferably further containing 5-90pts.wt. phenolic derivative and consisting of a two-pack system prepared by separating the components (C) and (D) as another solution system.