PHOTORESIST COMPOSITION

PURPOSE:To improve the heat resistance, sensitivity and resolution of a film by using high mol.wt. alkyl substituted phenol novolak resin having >=1,500 number average mol.wt. measured by a vapor pressure method using dimethylacetamide as a solvent as a component of a resist. CONSTITUTION:This ph...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: NAKANO YOSHIKAZU, KADA MASUMI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PURPOSE:To improve the heat resistance, sensitivity and resolution of a film by using high mol.wt. alkyl substituted phenol novolak resin having >=1,500 number average mol.wt. measured by a vapor pressure method using dimethylacetamide as a solvent as a component of a resist. CONSTITUTION:This photoresist composition consists of 50-99pts.wt. high mol.wt. alkyl substituted phenol novolak resin (A) having >=1,500 number average mol.wt. measured by a vapor pressure method using dimethylacetamide as a solvent and 1-50pts.wt. positive diazo sensitizer (B). The resin A has alternately bonded phenol groups each having 1-9C alkyl groups as substituents at the o- or p-positions and methylene groups. Higher contrast is obtd. by reducing the ratio between the weight average mol.wt. of the resin A and the number average mol.wt. (degree of dispersion) and the preferred ratio is