PHOTORESIST COMPOSITION
PURPOSE:To improve the heat resistance, sensitivity and resolution of a film by using high mol.wt. alkyl substituted phenol novolak resin having >=1,500 number average mol.wt. measured by a vapor pressure method using dimethylacetamide as a solvent as a component of a resist. CONSTITUTION:This ph...
Gespeichert in:
Hauptverfasser: | , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | PURPOSE:To improve the heat resistance, sensitivity and resolution of a film by using high mol.wt. alkyl substituted phenol novolak resin having >=1,500 number average mol.wt. measured by a vapor pressure method using dimethylacetamide as a solvent as a component of a resist. CONSTITUTION:This photoresist composition consists of 50-99pts.wt. high mol.wt. alkyl substituted phenol novolak resin (A) having >=1,500 number average mol.wt. measured by a vapor pressure method using dimethylacetamide as a solvent and 1-50pts.wt. positive diazo sensitizer (B). The resin A has alternately bonded phenol groups each having 1-9C alkyl groups as substituents at the o- or p-positions and methylene groups. Higher contrast is obtd. by reducing the ratio between the weight average mol.wt. of the resin A and the number average mol.wt. (degree of dispersion) and the preferred ratio is |
---|