PHOTOSENSITIVE RESIST COMPOSITION
PURPOSE:To improve the heat resistance, sensitivity and resolution of a film by using high mol.wt. alkyl substituted phenol novolak resin having >=1,500 number average mol.wt. as a component of a resist. CONSTITUTION:This photosensitive resist composition consists of 40-98pts.wt. high mol.wt. alk...
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| creator | NAKANO YOSHITOMO KADA MASUMI |
| description | PURPOSE:To improve the heat resistance, sensitivity and resolution of a film by using high mol.wt. alkyl substituted phenol novolak resin having >=1,500 number average mol.wt. as a component of a resist. CONSTITUTION:This photosensitive resist composition consists of 40-98pts.wt. high mol.wt. alkyl substituted phenol novolak resin (A) obtd. by reacting phenol having 1-9 C alkyl groups as substituents at the o- or p-positions with formaldehyde and having >=1,500 number average mol.wt. measured by a vapor pressure method using dimethylacetamide as a solvent and 60-2pts.wt. compound (B) having at least one aromatic azido group in one molecule. Higher contrast is obtd. by reducing the ratio between the weight average mol.wt. of the resin A and the number average mol.wt. (degree of dispersion) and the preferred ratio is |
| format | Patent |
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CONSTITUTION:This photosensitive resist composition consists of 40-98pts.wt. high mol.wt. alkyl substituted phenol novolak resin (A) obtd. by reacting phenol having 1-9 C alkyl groups as substituents at the o- or p-positions with formaldehyde and having >=1,500 number average mol.wt. measured by a vapor pressure method using dimethylacetamide as a solvent and 60-2pts.wt. compound (B) having at least one aromatic azido group in one molecule. Higher contrast is obtd. by reducing the ratio between the weight average mol.wt. of the resin A and the number average mol.wt. (degree of dispersion) and the preferred ratio is <=3.5. the aromatic azido compound B can be selected among various monoazido and bisazido compounds. The resist composition is generally dissolved in a solvent and the resulting photosensitive composition is applied to a substrate to form a thin film.</description><language>eng</language><subject>ADHESIVES ; APPARATUS SPECIALLY ADAPTED THEREFOR ; AUXILIARY PROCESSES IN PHOTOGRAPHY ; CHEMISTRY ; CINEMATOGRAPHY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; DYES ; ELECTROGRAPHY ; HOLOGRAPHY ; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE ; MATERIALS THEREFOR ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; ORGANIC MACROMOLECULAR COMPOUNDS ; ORIGINALS THEREFOR ; PAINTS ; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR,STEREO-PHOTOGRAPHIC PROCESSES ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES ; PHYSICS ; POLISHES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><creationdate>1987</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19870717&DB=EPODOC&CC=JP&NR=S62161145A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19870717&DB=EPODOC&CC=JP&NR=S62161145A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NAKANO YOSHITOMO</creatorcontrib><creatorcontrib>KADA MASUMI</creatorcontrib><title>PHOTOSENSITIVE RESIST COMPOSITION</title><description>PURPOSE:To improve the heat resistance, sensitivity and resolution of a film by using high mol.wt. alkyl substituted phenol novolak resin having >=1,500 number average mol.wt. as a component of a resist. CONSTITUTION:This photosensitive resist composition consists of 40-98pts.wt. high mol.wt. alkyl substituted phenol novolak resin (A) obtd. by reacting phenol having 1-9 C alkyl groups as substituents at the o- or p-positions with formaldehyde and having >=1,500 number average mol.wt. measured by a vapor pressure method using dimethylacetamide as a solvent and 60-2pts.wt. compound (B) having at least one aromatic azido group in one molecule. Higher contrast is obtd. by reducing the ratio between the weight average mol.wt. of the resin A and the number average mol.wt. (degree of dispersion) and the preferred ratio is <=3.5. the aromatic azido compound B can be selected among various monoazido and bisazido compounds. The resist composition is generally dissolved in a solvent and the resulting photosensitive composition is applied to a substrate to form a thin film.</description><subject>ADHESIVES</subject><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>AUXILIARY PROCESSES IN PHOTOGRAPHY</subject><subject>CHEMISTRY</subject><subject>CINEMATOGRAPHY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>DYES</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE</subject><subject>MATERIALS THEREFOR</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>ORIGINALS THEREFOR</subject><subject>PAINTS</subject><subject>PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR,STEREO-PHOTOGRAPHIC PROCESSES</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES</subject><subject>PHYSICS</subject><subject>POLISHES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1987</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFAM8PAP8Q929Qv2DPEMc1UIcg32DA5RcPb3DfAHCfn78TCwpiXmFKfyQmluBkU31xBnD93Ugvz41OKCxOTUvNSSeK-AYDMjQzNDQxNTR2Ni1AAAW3cjBg</recordid><startdate>19870717</startdate><enddate>19870717</enddate><creator>NAKANO YOSHITOMO</creator><creator>KADA MASUMI</creator><scope>EVB</scope></search><sort><creationdate>19870717</creationdate><title>PHOTOSENSITIVE RESIST COMPOSITION</title><author>NAKANO YOSHITOMO ; KADA MASUMI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPS62161145A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1987</creationdate><topic>ADHESIVES</topic><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>AUXILIARY PROCESSES IN PHOTOGRAPHY</topic><topic>CHEMISTRY</topic><topic>CINEMATOGRAPHY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>DYES</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE</topic><topic>MATERIALS THEREFOR</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>ORIGINALS THEREFOR</topic><topic>PAINTS</topic><topic>PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR,STEREO-PHOTOGRAPHIC PROCESSES</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES</topic><topic>PHYSICS</topic><topic>POLISHES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><toplevel>online_resources</toplevel><creatorcontrib>NAKANO YOSHITOMO</creatorcontrib><creatorcontrib>KADA MASUMI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NAKANO YOSHITOMO</au><au>KADA MASUMI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PHOTOSENSITIVE RESIST COMPOSITION</title><date>1987-07-17</date><risdate>1987</risdate><abstract>PURPOSE:To improve the heat resistance, sensitivity and resolution of a film by using high mol.wt. alkyl substituted phenol novolak resin having >=1,500 number average mol.wt. as a component of a resist. CONSTITUTION:This photosensitive resist composition consists of 40-98pts.wt. high mol.wt. alkyl substituted phenol novolak resin (A) obtd. by reacting phenol having 1-9 C alkyl groups as substituents at the o- or p-positions with formaldehyde and having >=1,500 number average mol.wt. measured by a vapor pressure method using dimethylacetamide as a solvent and 60-2pts.wt. compound (B) having at least one aromatic azido group in one molecule. Higher contrast is obtd. by reducing the ratio between the weight average mol.wt. of the resin A and the number average mol.wt. (degree of dispersion) and the preferred ratio is <=3.5. the aromatic azido compound B can be selected among various monoazido and bisazido compounds. The resist composition is generally dissolved in a solvent and the resulting photosensitive composition is applied to a substrate to form a thin film.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVES APPARATUS SPECIALLY ADAPTED THEREFOR AUXILIARY PROCESSES IN PHOTOGRAPHY CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTROGRAPHY HOLOGRAPHY MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE MATERIALS THEREFOR METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PAINTS PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR,STEREO-PHOTOGRAPHIC PROCESSES PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES PHYSICS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS |
| title | PHOTOSENSITIVE RESIST COMPOSITION |
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