PHOTOSENSITIVE RESIST COMPOSITION

PURPOSE:To improve the heat resistance, sensitivity and resolution of a film by using high mol.wt. alkyl substituted phenol novolak resin having >=1,500 number average mol.wt. as a component of a resist. CONSTITUTION:This photosensitive resist composition consists of 40-98pts.wt. high mol.wt. alk...

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Bibliographische Detailangaben
Hauptverfasser: NAKANO YOSHITOMO, KADA MASUMI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PURPOSE:To improve the heat resistance, sensitivity and resolution of a film by using high mol.wt. alkyl substituted phenol novolak resin having >=1,500 number average mol.wt. as a component of a resist. CONSTITUTION:This photosensitive resist composition consists of 40-98pts.wt. high mol.wt. alkyl substituted phenol novolak resin (A) obtd. by reacting phenol having 1-9 C alkyl groups as substituents at the o- or p-positions with formaldehyde and having >=1,500 number average mol.wt. measured by a vapor pressure method using dimethylacetamide as a solvent and 60-2pts.wt. compound (B) having at least one aromatic azido group in one molecule. Higher contrast is obtd. by reducing the ratio between the weight average mol.wt. of the resin A and the number average mol.wt. (degree of dispersion) and the preferred ratio is