POSITIVE TYPE PHOTORESIST COMPOSITION

PURPOSE:To improve the anti-dryetching property of the titled composition by compounding a quinone diazide compd. and a cresol-formaldehyde novolak resin having a prescribed condition in a ratio of 1:(4-7). CONSTITUTION:The cresol-formalde novolak resin which is a relatively high polymer and has a w...

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Bibliographische Detailangaben
Hauptverfasser: KONISHI SHINJI, HANABATAKE MAKOTO, FURUTA AKIHIRO, KURATA NOBUYUKI, HORIKAWA YASUHIKO
Format: Patent
Sprache:eng
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Zusammenfassung:PURPOSE:To improve the anti-dryetching property of the titled composition by compounding a quinone diazide compd. and a cresol-formaldehyde novolak resin having a prescribed condition in a ratio of 1:(4-7). CONSTITUTION:The cresol-formalde novolak resin which is a relatively high polymer and has a weight average molecular weight of 10,000-25,000 is obtd. by using an acidic catalyst from a starting material of m, p mixed cresols having a compounding ratio of m-cresol/p-cresol of 50/50-80/20. The compounding ratio of the quinone diazide compd. and the cresol formaldehyde novolak resin is a specific range of 1:(4-7). Thus, the titled composition having the excellent heat-resisting and anti-dryetching properties, maintaining the high sensitivity is obtd.