SEMICONDUCTOR DEVICE

PURPOSE:To maintain connection of bonding wiring with a wiring layer even if a bonding pad is corroded by connecting the layer with the pad directly under connecting portions of the wirings with the pad. CONSTITUTION:Internal wirings 21 of polysilicon extended on a silicon oxide film 2 arrive at a p...

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Bibliographische Detailangaben
1. Verfasser:	KOSHIMARU SHIGERU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PURPOSE:To maintain connection of bonding wiring with a wiring layer even if a bonding pad is corroded by connecting the layer with the pad directly under connecting portions of the wirings with the pad. CONSTITUTION:Internal wirings 21 of polysilicon extended on a silicon oxide film 2 arrive at a portion directly under a connecting portion of bonding wirings 9 with a bonding pad 6, and are connected with the pad 6 through a contacting hole 22 opened in an insulating film 4. Accordingly, the wirings 9 are electrically connected with the wirings 21 without intermediary of corrosion possible regions A, B. Even if the regions A, B are corroded in future, the wirings 21 can receive an electric signal from the wirings 9 through the pad 6.