ELECTROPLATING APPARATUS

ELECTROPLATING APPARATUS

PURPOSE:To reduce the oxidation of metallic ions by dissolved oxygen in an electroplating apparatus in which plating is carried out by circulating a plating soln. between the plating vessel and the circulating tank, by placing a net on the downstream side of the plating soln. pouring pipe of the cir...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: YAMATO KOJI, HONJO TORU
Format: Patent
Sprache:eng
Schlagworte:
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:PURPOSE:To reduce the oxidation of metallic ions by dissolved oxygen in an electroplating apparatus in which plating is carried out by circulating a plating soln. between the plating vessel and the circulating tank, by placing a net on the downstream side of the plating soln. pouring pipe of the circulating tank. CONSTITUTION:Plating is carried out in an electroplating apparatus by circulating a plating soln. between the plating vessel and the circulating tank 10. At this time, a net 13 having 0.5-6mm minimum width of meshes is placed on the downstream side of the plating soln. pouring pipe 9 of the circulating tank 10 so that bubbles sucked into the plating soln. in the plating vessel float up only on the pipe 9 side and are not sucked into the plating soln. sucking pipe 11. Accordingly, the oxidation of metallic ions by dissolved oxygen is reduced.