SURFACE ACOUSTIC WAVE ELEMENT

PURPOSE:To improve the reliability of a surface acoustic wave element by using a multi-layer printed wiring board to seal up the electrode surface and preventing the mixture of the foreign matters. CONSTITUTION:This surface acoustic wave element consists of an element main body 11 and a multi-layer...

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Bibliographische Detailangaben
1. Verfasser: TAKOJIMA TAKEHIRO
Format: Patent
Sprache:eng
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Zusammenfassung:PURPOSE:To improve the reliability of a surface acoustic wave element by using a multi-layer printed wiring board to seal up the electrode surface and preventing the mixture of the foreign matters. CONSTITUTION:This surface acoustic wave element consists of an element main body 11 and a multi-layer printed wiring board 21. The main body 11 contains plural interdigital electrodes 13 formed on the surface of a piezoelectric substrate 12 and each electrode 13 includes a terminal part 14. While the board 21 contains laminated substrates 22-24 and a terminal part 25 is formed on the surface of the highest substrate 22 and opposite to the part 14 of the main body 11. while the substrates 23 and 24 include circuits forming a peripheral circuit (not shown in figure). Then a synthetic rubber/synthetic resin 27 is applied to the fringe part of the upper side of the board 21.