GOLD WIRE FOR BONDING SEMICONDUCTOR ELEMENT

PURPOSE:To improve the mechanical strength of a high-purity gold wire by a synergetic effect while increasing adhesive strength in a second bonding section by adequately adding Ge and Be to the gold wire for bonding. CONSTITUTION:0.0032-0.0060wt% germanium Ge and 0.00001-0.00009wt% beryllium are made to be contained in 99.996-99.99995wt% high-purity gold Au, melted and cast, and finished to an Au wire for bonding having a 25mum diameter by repeating wire drawing working and intermediate processing. Mechanical strength, such as the tensile strength, high-temperature strength, etc. of high-purity gold can be improved by the synergetic effect of germanium Ge and beryllium Be while adhesive strength can also be increased, and breaking at a neck can be prevented by the addition of beryllium Be.