FORMATION OF LEAD

PURPOSE:To alleviate a stress to sealing body of lead by bending the base end side of lead to the other direction after bending the end point side of lead in the one direction. CONSTITUTION:A tool is applied to the upper side of end point side of a lead 2 and the end point side of lead 2 is bent alm...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	OGURI KEIJI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!