FORMATION OF LEAD

PURPOSE:To alleviate a stress to sealing body of lead by bending the base end side of lead to the other direction after bending the end point side of lead in the one direction. CONSTITUTION:A tool is applied to the upper side of end point side of a lead 2 and the end point side of lead 2 is bent alm...

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Bibliographische Detailangaben
1. Verfasser: OGURI KEIJI
Format: Patent
Sprache:eng
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Zusammenfassung:PURPOSE:To alleviate a stress to sealing body of lead by bending the base end side of lead to the other direction after bending the end point side of lead in the one direction. CONSTITUTION:A tool is applied to the upper side of end point side of a lead 2 and the end point side of lead 2 is bent almost at the right angle in the direction of the arrow mark A. In this time, an compressive stressed C1, C2 work in the side of the one surface 2a at the end point side of lead to be bent, while tensile stresses t1, t2 work at the opposite surface 2b. In this case, these compressive stresses C1, C2, tensile stresses t1, t2 become maximum at the bending portions but since the first bending portion 3a is separated far from the resin 1, these stresses are not so much transferred to the resin 1.