WIRE-BONDING

PURPOSE:To contrive not to give damage to the bonding wires which have been connected by a method wherein the inner lead bonding pads disposed at the positions near the outer periphery of the semiconductor chip and the outer lead bonding pads disposed at the positions near the semiconductor chip in opposition to the inner lead bonding pads are connected in order, and after that, the remaining inner lead and outer lead bonding pads are connected sequentially. CONSTITUTION:Mutually opposed inner lead bonding pads 3 and outer lead bonding pads 4 are connected with each other. First of all, the inner lead bonding pads 3 disposed at the positions near the outer periphery of a semiconductor chip 2 and the outer lead bonding pads 4 disposed at the positions near the semiconductor chip 2 are connected in order using bonding wires 5 so that pairs of the mutually opposed inner lead bonding pads 3 and outer lead bonding pads 4 are connected in every other pair. Then, the remaining inner lead bonding pads 3 disposed at the positions far from the outer periphery of the semiconductor chip 2 and the remaining outer lead bonding pads 4 disposed at the positions far from the semiconductor chip 2 are connected in order using the bonding wires 5 in the same manner. By this method, the trouble that the point of one of the capillaries comes into contact with the bonding wire 5 adjacent to the capillary and damage to the point is never generated.