PHOTOSENSITIVE FILM FOR FORMING SOLDER RESIST

PURPOSE:To improve the adhesion of a solder resist to a printed wiring board by providing a two-layered structure consisting of hard and soft layers to a photosensitive layer and by adhering the soft layer to the uneven surface of the wiring board. CONSTITUTION:Hard and soft photosensitive layers ar...

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Bibliographische Detailangaben
Hauptverfasser:	HAYASE SHUJI, OBARA TEIJI, SUZUKI SHIYUICHI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR AUXILIARY PROCESSES IN PHOTOGRAPHY CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CINEMATOGRAPHY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR,STEREO-PHOTOGRAPHIC PROCESSES PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES PHYSICS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PURPOSE:To improve the adhesion of a solder resist to a printed wiring board by providing a two-layered structure consisting of hard and soft layers to a photosensitive layer and by adhering the soft layer to the uneven surface of the wiring board. CONSTITUTION:Hard and soft photosensitive layers are successively laminated on a light transmsitting film 1 of polyethylene terephthalate or the like. The hard photosensitive layer is a layer 2 of a solid photosetting resin composition such as a photosetting acrylate resin composition. The soft photosensitive layer is a layer 3 of a photosetting resin composition which is solid at ordinary temp. and liq. under heating such as an acrylate resin composition. The soft photosensitive layer may be coated with a protective film 4. When the soft photosensitive layer 3 is adhered to the uneven surface of a printed wiring board in a liq. state, it is well adhered because air is removed. The photosensitive layers 2, 4 are then irradiated with light through a prescribed pattern to set the resins. Thus, the adhesion of the resulting solder resist can be improved by forming the soft photosensitive layer.