SEMICONDUCTOR DEVICE

PURPOSE:To externally efficiently dissipate heat generated when a semiconductor device is operated by filling a thermal conductive resin at least one of between the upper surface of a pellet and the back surface of a cap and between the back surface of the pellet and the upper surface of a substrate. CONSTITUTION:The entire pellet 5 mounted on a substrate 1 is coated with a silicone gel 10 of a thermal conductive material, and the gel 10 is filled between the back surface of the cap 4 and the upper surface of the substrate 1. When thus constructed, since the heat generated from the pellet 5 can be dissipated efficiently through the gel 10 to the cap 4, the overheat of the pellet 5 can be prevented.