WAFER CHUCK MECHANISM

PURPOSE:To make the centering motion of a wafer performable without using a chuck for sticking release with the wafer, by installing a guide for releasing a pair of opposed holding devices when a rotating arm is set to horizontality. CONSTITUTION:A silicon wafer 1 is conveyed onto a circular table,...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	WATANABE TOSHIHITO, KOBAYASHI SHIGEKI, SUZUKI MASAFUMI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHAMBERS PROVIDED WITH MANIPULATION DEVICES COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT CONVEYING DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HAND TOOLS HANDLING THIN OR FILAMENTARY MATERIAL HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS,CABLES MACHINE TOOLS MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS MANIPULATORS METAL-WORKING NOT OTHERWISE PROVIDED FOR PACKING PERFORMING OPERATIONS PNEUMATIC TUBE CONVEYORS PORTABLE POWER-DRIVEN TOOLS SEMICONDUCTOR DEVICES SHOP CONVEYOR SYSTEMS STORING TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING TRANSPORTING
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Beschreibung
Zusammenfassung:	PURPOSE:To make the centering motion of a wafer performable without using a chuck for sticking release with the wafer, by installing a guide for releasing a pair of opposed holding devices when a rotating arm is set to horizontality. CONSTITUTION:A silicon wafer 1 is conveyed onto a circular table, and an arm unit is slightly rotated in a vertical direction,layer claws 4a, 4b and 5a, 5b upside down, then the wafer 1 is held while centering it. Next, after spattering is applied to the wafer 1 at a vertical position, again the arm unit is rotated and the circular table 2 is put back to a horizontal position. At this process, these claws 4a, 4b and 5a, 5b are moved beneath each of guides 7a, 7b and 8a, 8b, thus holding of the wafer 1 is released.