ELECTROLESS PLATING METHOD ON TRANSPARENT ELECTRICALLY-CONDUCTIVE FILM
PURPOSE:To form an electroless plated film on an electrically-conductive film in the excellent adhesive properties by treating the transparent electrically- conductive film with a soln. of hydrazine, polyethyleneimine and the specified hydroxyalkylamine to activate it. CONSTITUTION:The surface of a...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | YOSHIKATA TOSHIYUKI KUBOI YOSHIO |
| description | PURPOSE:To form an electroless plated film on an electrically-conductive film in the excellent adhesive properties by treating the transparent electrically- conductive film with a soln. of hydrazine, polyethyleneimine and the specified hydroxyalkylamine to activate it. CONSTITUTION:The surface of a transparent electrically-conductive film is treated with an activated soln. contg. 5-100g/l one or more kinds of hydrazine, hydrazine salts, polyethyleneimine, hydroxyalkyl-amine shown in a general formula I and amines shown in a general formula II. The pH of the soln. is regulated to 3-1. Still more in the general formula I, R1, R2 and R3 show H, hydroxyethyl or hydroxypropyl and (n) of the general formula II is 1-5 integer. A catalyst is imparted on the activated electrically-conductive film and the electroless plating such as Ni is performed. By this method, the plated film strong in the adhesive properties can be formed on an ITO film. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JPS61272387A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JPS61272387A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JPS61272387A3</originalsourceid><addsrcrecordid>eNrjZHBz9XF1Dgny93ENDlYI8HEM8fRzV_B1DfHwd1Hw91MICXL0Cw5wDHL1C1GAqPR0dvTxidR19vdzCXUO8QxzVXDz9PHlYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxXgHBZoZG5kbGFuaOxsSoAQDt0C0X</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>ELECTROLESS PLATING METHOD ON TRANSPARENT ELECTRICALLY-CONDUCTIVE FILM</title><source>esp@cenet</source><creator>YOSHIKATA TOSHIYUKI ; KUBOI YOSHIO</creator><creatorcontrib>YOSHIKATA TOSHIYUKI ; KUBOI YOSHIO</creatorcontrib><description>PURPOSE:To form an electroless plated film on an electrically-conductive film in the excellent adhesive properties by treating the transparent electrically- conductive film with a soln. of hydrazine, polyethyleneimine and the specified hydroxyalkylamine to activate it. CONSTITUTION:The surface of a transparent electrically-conductive film is treated with an activated soln. contg. 5-100g/l one or more kinds of hydrazine, hydrazine salts, polyethyleneimine, hydroxyalkyl-amine shown in a general formula I and amines shown in a general formula II. The pH of the soln. is regulated to 3-1. Still more in the general formula I, R1, R2 and R3 show H, hydroxyethyl or hydroxypropyl and (n) of the general formula II is 1-5 integer. A catalyst is imparted on the activated electrically-conductive film and the electroless plating such as Ni is performed. By this method, the plated film strong in the adhesive properties can be formed on an ITO film.</description><language>eng</language><subject>CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>1986</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19861202&DB=EPODOC&CC=JP&NR=S61272387A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,778,883,25551,76302</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19861202&DB=EPODOC&CC=JP&NR=S61272387A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YOSHIKATA TOSHIYUKI</creatorcontrib><creatorcontrib>KUBOI YOSHIO</creatorcontrib><title>ELECTROLESS PLATING METHOD ON TRANSPARENT ELECTRICALLY-CONDUCTIVE FILM</title><description>PURPOSE:To form an electroless plated film on an electrically-conductive film in the excellent adhesive properties by treating the transparent electrically- conductive film with a soln. of hydrazine, polyethyleneimine and the specified hydroxyalkylamine to activate it. CONSTITUTION:The surface of a transparent electrically-conductive film is treated with an activated soln. contg. 5-100g/l one or more kinds of hydrazine, hydrazine salts, polyethyleneimine, hydroxyalkyl-amine shown in a general formula I and amines shown in a general formula II. The pH of the soln. is regulated to 3-1. Still more in the general formula I, R1, R2 and R3 show H, hydroxyethyl or hydroxypropyl and (n) of the general formula II is 1-5 integer. A catalyst is imparted on the activated electrically-conductive film and the electroless plating such as Ni is performed. By this method, the plated film strong in the adhesive properties can be formed on an ITO film.</description><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1986</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHBz9XF1Dgny93ENDlYI8HEM8fRzV_B1DfHwd1Hw91MICXL0Cw5wDHL1C1GAqPR0dvTxidR19vdzCXUO8QxzVXDz9PHlYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxXgHBZoZG5kbGFuaOxsSoAQDt0C0X</recordid><startdate>19861202</startdate><enddate>19861202</enddate><creator>YOSHIKATA TOSHIYUKI</creator><creator>KUBOI YOSHIO</creator><scope>EVB</scope></search><sort><creationdate>19861202</creationdate><title>ELECTROLESS PLATING METHOD ON TRANSPARENT ELECTRICALLY-CONDUCTIVE FILM</title><author>YOSHIKATA TOSHIYUKI ; KUBOI YOSHIO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPS61272387A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1986</creationdate><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>YOSHIKATA TOSHIYUKI</creatorcontrib><creatorcontrib>KUBOI YOSHIO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YOSHIKATA TOSHIYUKI</au><au>KUBOI YOSHIO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ELECTROLESS PLATING METHOD ON TRANSPARENT ELECTRICALLY-CONDUCTIVE FILM</title><date>1986-12-02</date><risdate>1986</risdate><abstract>PURPOSE:To form an electroless plated film on an electrically-conductive film in the excellent adhesive properties by treating the transparent electrically- conductive film with a soln. of hydrazine, polyethyleneimine and the specified hydroxyalkylamine to activate it. CONSTITUTION:The surface of a transparent electrically-conductive film is treated with an activated soln. contg. 5-100g/l one or more kinds of hydrazine, hydrazine salts, polyethyleneimine, hydroxyalkyl-amine shown in a general formula I and amines shown in a general formula II. The pH of the soln. is regulated to 3-1. Still more in the general formula I, R1, R2 and R3 show H, hydroxyethyl or hydroxypropyl and (n) of the general formula II is 1-5 integer. A catalyst is imparted on the activated electrically-conductive film and the electroless plating such as Ni is performed. By this method, the plated film strong in the adhesive properties can be formed on an ITO film.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_JPS61272387A |
| source | esp@cenet |
| subjects | CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | ELECTROLESS PLATING METHOD ON TRANSPARENT ELECTRICALLY-CONDUCTIVE FILM |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-16T04%3A05%3A21IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=YOSHIKATA%20TOSHIYUKI&rft.date=1986-12-02&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJPS61272387A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |