ELECTROLESS PLATING METHOD ON TRANSPARENT ELECTRICALLY-CONDUCTIVE FILM

PURPOSE:To form an electroless plated film on an electrically-conductive film in the excellent adhesive properties by treating the transparent electrically- conductive film with a soln. of hydrazine, polyethyleneimine and the specified hydroxyalkylamine to activate it. CONSTITUTION:The surface of a...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	YOSHIKATA TOSHIYUKI, KUBOI YOSHIO
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PURPOSE:To form an electroless plated film on an electrically-conductive film in the excellent adhesive properties by treating the transparent electrically- conductive film with a soln. of hydrazine, polyethyleneimine and the specified hydroxyalkylamine to activate it. CONSTITUTION:The surface of a transparent electrically-conductive film is treated with an activated soln. contg. 5-100g/l one or more kinds of hydrazine, hydrazine salts, polyethyleneimine, hydroxyalkyl-amine shown in a general formula I and amines shown in a general formula II. The pH of the soln. is regulated to 3-1. Still more in the general formula I, R1, R2 and R3 show H, hydroxyethyl or hydroxypropyl and (n) of the general formula II is 1-5 integer. A catalyst is imparted on the activated electrically-conductive film and the electroless plating such as Ni is performed. By this method, the plated film strong in the adhesive properties can be formed on an ITO film.