TEACHING METHOD FOR CUT AND CRIMP OF ELECTRONIC PARTS

PURPOSE:To perform teaching operation easily and quickly by using a transparent substrate and teaching a device with the substrate fixed. CONSTITUTION:Substrate supporters 8 of a cut and crimp device B support a transparent substrate 1a which has the same dimension as the substrate 1 where electronic parts are inserted and leads of the parts are cut and crimped and which has lead insertion holes of the same diameter and of the same arrangement as that on the substrate 1. A controller 10 is commanded a start of teaching by depressing the teaching start pushbutton on a teaching operation panel 9. A cutter 17 is moved under a lead insertion hole 11a by depressing an X direction movement pushbutton and a Y direction movement pushbutton. When the cutting edge of the cutter 17 is positioned at the center of the hole 11a, the registration pushbutton on the panel 9 is depressed to memorize the X and Y coordinates of the center of the hole 11a into the controller 10. Then, the cutter 17 is moved to the next teaching position of a lead insertion hole 11b to store a cut and crimp position into the controller 10 in the same manner.