RESIN SEALED TYPE SEMICONDUCTOR DEVICE

PURPOSE:To improve reliability under the state of a high temperature and high humidity by compounding a two-functional epoxy compound represented by a specific chemical formula to a resin composition. CONSTITUTION:A two-functional epoxy compound represented by a specific chemical formula (in formula...

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Bibliographische Detailangaben
Hauptverfasser:	NISHIKAWA AKIO, OGATA MASAJI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PURPOSE:To improve reliability under the state of a high temperature and high humidity by compounding a two-functional epoxy compound represented by a specific chemical formula to a resin composition. CONSTITUTION:A two-functional epoxy compound represented by a specific chemical formula (in formula, R represents either of H or CH3 and m 1-4) is compounded to a resin composition. Substances, such as the powder of calcium carbonate, silicate, etc. and a short fiber-shaped filler, a mold release agent, a coupling agent and a flame retardant are added to the resin composition in response to the application of the composition and the object of use thereof. Accordingly, reliability under the state of a high temperature and high humidity is improved.