SEMICONDUCTOR DEVICE

PURPOSE:To prevent solder from depositing on an input lead or an output lead by a method wherein a cap is welded on a frame ceramic provided with cutouts via seal plate. CONSTITUTION:The seal plate 9 having a uniform width is laminated or brazed on the frame ceramic 4 provided with cutouts for insta...

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1. Verfasser:	OGATA TOSHIICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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creator	OGATA TOSHIICHI
description	PURPOSE:To prevent solder from depositing on an input lead or an output lead by a method wherein a cap is welded on a frame ceramic provided with cutouts via seal plate. CONSTITUTION:The seal plate 9 having a uniform width is laminated or brazed on the frame ceramic 4 provided with cutouts for installing the input lead 5 and the output lead 6. The cap 8 is fixed on this plate 9 via solder layer 7 and hermetically sealed. Such a construction enables the cap 8 to be bonded to the uniform surface and eliminates the deposition of solder to each lead 5 and 6 due to outflow at the time of cap sealing.
format	Patent
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CONSTITUTION:The seal plate 9 having a uniform width is laminated or brazed on the frame ceramic 4 provided with cutouts for installing the input lead 5 and the output lead 6. The cap 8 is fixed on this plate 9 via solder layer 7 and hermetically sealed. Such a construction enables the cap 8 to be bonded to the uniform surface and eliminates the deposition of solder to each lead 5 and 6 due to outflow at the time of cap sealing.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>1986</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19860205&DB=EPODOC&CC=JP&NR=S6126247A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19860205&DB=EPODOC&CC=JP&NR=S6126247A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>OGATA TOSHIICHI</creatorcontrib><title>SEMICONDUCTOR DEVICE</title><description>PURPOSE:To prevent solder from depositing on an input lead or an output lead by a method wherein a cap is welded on a frame ceramic provided with cutouts via seal plate. CONSTITUTION:The seal plate 9 having a uniform width is laminated or brazed on the frame ceramic 4 provided with cutouts for installing the input lead 5 and the output lead 6. The cap 8 is fixed on this plate 9 via solder layer 7 and hermetically sealed. Such a construction enables the cap 8 to be bonded to the uniform surface and eliminates the deposition of solder to each lead 5 and 6 due to outflow at the time of cap sealing.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1986</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBAJdvX1dPb3cwl1DvEPUnBxDfN0duVhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfFeAcFmhkZmRibmjsZEKAEAT_semA</recordid><startdate>19860205</startdate><enddate>19860205</enddate><creator>OGATA TOSHIICHI</creator><scope>EVB</scope></search><sort><creationdate>19860205</creationdate><title>SEMICONDUCTOR DEVICE</title><author>OGATA TOSHIICHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPS6126247A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1986</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>OGATA TOSHIICHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>OGATA TOSHIICHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SEMICONDUCTOR DEVICE</title><date>1986-02-05</date><risdate>1986</risdate><abstract>PURPOSE:To prevent solder from depositing on an input lead or an output lead by a method wherein a cap is welded on a frame ceramic provided with cutouts via seal plate. CONSTITUTION:The seal plate 9 having a uniform width is laminated or brazed on the frame ceramic 4 provided with cutouts for installing the input lead 5 and the output lead 6. The cap 8 is fixed on this plate 9 via solder layer 7 and hermetically sealed. Such a construction enables the cap 8 to be bonded to the uniform surface and eliminates the deposition of solder to each lead 5 and 6 due to outflow at the time of cap sealing.</abstract><oa>free_for_read</oa></addata></record>
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subjects	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
title	SEMICONDUCTOR DEVICE
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