SEMICONDUCTOR DEVICE

PURPOSE:To prevent solder from depositing on an input lead or an output lead by a method wherein a cap is welded on a frame ceramic provided with cutouts via seal plate. CONSTITUTION:The seal plate 9 having a uniform width is laminated or brazed on the frame ceramic 4 provided with cutouts for insta...

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Bibliographische Detailangaben
1. Verfasser:	OGATA TOSHIICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	PURPOSE:To prevent solder from depositing on an input lead or an output lead by a method wherein a cap is welded on a frame ceramic provided with cutouts via seal plate. CONSTITUTION:The seal plate 9 having a uniform width is laminated or brazed on the frame ceramic 4 provided with cutouts for installing the input lead 5 and the output lead 6. The cap 8 is fixed on this plate 9 via solder layer 7 and hermetically sealed. Such a construction enables the cap 8 to be bonded to the uniform surface and eliminates the deposition of solder to each lead 5 and 6 due to outflow at the time of cap sealing.