PRODUCTION OF FINE PARTICLE OF HEAT-RESISTANT RESIN

PURPOSE:To obtain resin particles having narrow particle diameter distribution and excellent heat-resistance, solvent-resistance, slipperiness and electrical characteristics, and useful as an agent for improving the heat-resistance of plastics, etc., by the emulsion polymerization or suspension poly...

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Bibliographische Detailangaben
Hauptverfasser: FUJIWARA TERUAKI, TAKEHARA HIDETOSHI, TAKIYAMA KEIICHI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PURPOSE:To obtain resin particles having narrow particle diameter distribution and excellent heat-resistance, solvent-resistance, slipperiness and electrical characteristics, and useful as an agent for improving the heat-resistance of plastics, etc., by the emulsion polymerization or suspension polymerization of a polymerizable monomer composition containing a maleimide compound. CONSTITUTION:A polymerizable monomer composition containing a maleimide compound of formula [R1 and R2 are H, halogen, 1-15C alkyl or (substituted) aryl; R3 is H, 1-15C alkyl, cycloalkyl or (substituted) aryl] (e.g. N- methylmaleimide, alpha-chloro-N-phenylmaleimide, etc.) (e.g. the above maleimide compound is used in combination with methyl methacrylate, etc.) is subjected to emulsion polymerization or suspension polymerization, and polymer particles having particle diameter of preferably 0.01-100mu are separated from the resultant emulsion or suspension and dried to obtain the objective particles.