PRODUCTION OF FINE PARTICLE OF HEAT-RESISTANT RESIN
PURPOSE:To obtain resin particles having narrow particle diameter distribution and excellent heat-resistance, solvent-resistance, slipperiness and electrical characteristics, and useful as an agent for improving the heat-resistance of plastics, etc., by the emulsion polymerization or suspension poly...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | PURPOSE:To obtain resin particles having narrow particle diameter distribution and excellent heat-resistance, solvent-resistance, slipperiness and electrical characteristics, and useful as an agent for improving the heat-resistance of plastics, etc., by the emulsion polymerization or suspension polymerization of a polymerizable monomer composition containing a maleimide compound. CONSTITUTION:A polymerizable monomer composition containing a maleimide compound of formula [R1 and R2 are H, halogen, 1-15C alkyl or (substituted) aryl; R3 is H, 1-15C alkyl, cycloalkyl or (substituted) aryl] (e.g. N- methylmaleimide, alpha-chloro-N-phenylmaleimide, etc.) (e.g. the above maleimide compound is used in combination with methyl methacrylate, etc.) is subjected to emulsion polymerization or suspension polymerization, and polymer particles having particle diameter of preferably 0.01-100mu are separated from the resultant emulsion or suspension and dried to obtain the objective particles. |
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