BI-DIRECTIONAL DIODE

PURPOSE:To prevent a peeling from an adhesive tape of a pallet wafer on dicing by forming a bump electrode on one main surface side of a diode pellet so that height is made lower than that of a bump electrode on the other main surface side and an area is made larger than that of the bump electrode on the other main surface side. CONSTITUTION:A pellet wafer 38, on the surface and the back thereof a large number of diode elements 37, 37... with bump electrodes 35, 36 having different height and areas are formed, is manufactured. The back of the pellet wafer 38 is stuck to an adhesive tape 22. Since the height of the bump electrodes 36 on the back is low and areas thereof are large at that time, approximately the whole surface of the pellet wafer 38 is stuck to the adhesive tape 22, thus sufficiently increasing adhesion between the pellet wafer 38 and the adhesive tape 22.