CARRIER SYSTEM OF SEMICONDUCTOR WAFER

PURPOSE:To make it feasible to position wafers with different diameters from each other utilizing only one carrier system by a method wherein both a carrier system of wafer and a positioning system capable of positioning wafers with different diameters are provided. CONSTITUTION:A positioning member...

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Bibliographische Detailangaben
1. Verfasser:	SUGANUMA TATSUMI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT CONVEYING DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HANDLING THIN OR FILAMENTARY MATERIAL MACHINE TOOLS MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PACKING PERFORMING OPERATIONS PNEUMATIC TUBE CONVEYORS SEMICONDUCTOR DEVICES SHOP CONVEYOR SYSTEMS STORING TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING TRANSPORTING
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Beschreibung
Zusammenfassung:	PURPOSE:To make it feasible to position wafers with different diameters from each other utilizing only one carrier system by a method wherein both a carrier system of wafer and a positioning system capable of positioning wafers with different diameters are provided. CONSTITUTION:A positioning member is formed of two curved planes 11a and 11b provided with different levels and curvature diameters corresponding to the peripheral end shapes of two wafers with common central position. When a wafer 8 with small diameter is taken out utilizing this positioning member, the positioning member is fully lifted to make the curved plane 11a abut against the peripheral end of wafer 8. On the other hand, when another wafer 9 with larger diameter is picked up, the positioning member is lifted up to the level lower than that in case of said wafer 8 to make the curved plane 11b abut against the peripheral end of the wafer 9. In such a constitution, the lifting operation of positioning member 11 may be controlled by means of a pertinent sliding device.