SEMICONDUCTOR RECTIFIER

PURPOSE:To obtain a resin-sealed semiconductor rectifier having small bottom area by using an aluminum metallized substrate as a bottom plate of a frame- shaped resin case having no bottom plate, and projecting the substrate from the bottom of a case, thereby remarkably improving the heat dissipatin...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	SUGITA TOMOYUKI, NAITO KAZUYOSHI, SONODA KAZUO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC,OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWERSUPPLY SYSTEMS BASIC ELECTRIC ELEMENTS CONTROL OR REGULATION THEREOF CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUTPOWER CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERATION SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PURPOSE:To obtain a resin-sealed semiconductor rectifier having small bottom area by using an aluminum metallized substrate as a bottom plate of a frame- shaped resin case having no bottom plate, and projecting the substrate from the bottom of a case, thereby remarkably improving the heat dissipating characteristic. CONSTITUTION:A frame-shaped resin case 1 having no bottom plate is used, and a metal plate adapted for heat sink such as a substrate 8 metallized with ceramics 8a or copper pattern 8b to aluminum is used as a bottom to be engaged with the lower end of the case 1. The substrate 8 is projected from the bottom of the case 1 so as to be lower than the lower edge of the case 1 at the bottom of the substrate 8 to form an enclosure. In this structure, since heat generated from a diode 2 is radiated through the substrate 8 to the exterior, remarkably high heat sink characteristics are obtained.