MANUFACTURE OF MASK FOR X-RAY EXPOSURE
PURPOSE:To improve the precision of a mask external form and the size of the mask external form by shaping a plurality of X-ray absorptive patterns onto one surface, forming a reinforcing film onto the surface of an X-ray transmitting thin-film board with a substrate patterned for a support frame on...
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creator | IIMURA YUKIO SANO NAOTAKE |
description | PURPOSE:To improve the precision of a mask external form and the size of the mask external form by shaping a plurality of X-ray absorptive patterns onto one surface, forming a reinforcing film onto the surface of an X-ray transmitting thin-film board with a substrate patterned for a support frame on the other surface and cutting and dividing the thin-film board into a plurality of masks for X-ray exposure. CONSTITUTION:An X-ray absorptive pattern 3 is formed on one surface, and a reinforcing film 5 is shaped on the surface on the X-ray absorptive pattern side of an X-ray transmitting thin-film board 2 with a substrate 4' patterned for a support frame 4 on the other surface. A material, which gives a thin-film sufficient strength and can be dissolved and removed in aftertreatment or does not damage the function of a mask 1 for X-ray exposure, is used as the quality of materials of the reinforcing film. The reinforcing film is shaped, and the thin-film board is cut and separated while using reference markers 8 for cutting as marks. Accordingly, the high accuracy of cut end surfaces is acquired, thus improving the relative positional accuracy of a mask external form and the X-ray absorptive pattern. |
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CONSTITUTION:An X-ray absorptive pattern 3 is formed on one surface, and a reinforcing film 5 is shaped on the surface on the X-ray absorptive pattern side of an X-ray transmitting thin-film board 2 with a substrate 4' patterned for a support frame 4 on the other surface. A material, which gives a thin-film sufficient strength and can be dissolved and removed in aftertreatment or does not damage the function of a mask 1 for X-ray exposure, is used as the quality of materials of the reinforcing film. The reinforcing film is shaped, and the thin-film board is cut and separated while using reference markers 8 for cutting as marks. 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CONSTITUTION:An X-ray absorptive pattern 3 is formed on one surface, and a reinforcing film 5 is shaped on the surface on the X-ray absorptive pattern side of an X-ray transmitting thin-film board 2 with a substrate 4' patterned for a support frame 4 on the other surface. A material, which gives a thin-film sufficient strength and can be dissolved and removed in aftertreatment or does not damage the function of a mask 1 for X-ray exposure, is used as the quality of materials of the reinforcing film. The reinforcing film is shaped, and the thin-film board is cut and separated while using reference markers 8 for cutting as marks. 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CONSTITUTION:An X-ray absorptive pattern 3 is formed on one surface, and a reinforcing film 5 is shaped on the surface on the X-ray absorptive pattern side of an X-ray transmitting thin-film board 2 with a substrate 4' patterned for a support frame 4 on the other surface. A material, which gives a thin-film sufficient strength and can be dissolved and removed in aftertreatment or does not damage the function of a mask 1 for X-ray exposure, is used as the quality of materials of the reinforcing film. The reinforcing film is shaped, and the thin-film board is cut and separated while using reference markers 8 for cutting as marks. Accordingly, the high accuracy of cut end surfaces is acquired, thus improving the relative positional accuracy of a mask external form and the X-ray absorptive pattern.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES |
title | MANUFACTURE OF MASK FOR X-RAY EXPOSURE |
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