RESIN COMPOSITION

PURPOSE:A resin composition having a short curing reaction time and excellent mechanical properties, electric insulation and heat stability, comprising a formimidate group-containing compound, an epoxy group-containing compound and a phenolic compound. CONSTITUTION:0.01-0.5pt.wt. compound having at...

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Bibliographische Detailangaben
Hauptverfasser:	KIHARA NAOKO, SUZUKI SHIYUICHI
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PURPOSE:A resin composition having a short curing reaction time and excellent mechanical properties, electric insulation and heat stability, comprising a formimidate group-containing compound, an epoxy group-containing compound and a phenolic compound. CONSTITUTION:0.01-0.5pt.wt. compound having at least one formimidate group of the formula [wherein X is an n-valent hydrocarbon group bonded through at least one atomic group selected from among an aliphatic group, an alicyclic group, -CH2-, -O-, -SO2-, -CONH- and a heterocyclic group, R is a 1-20C alkyl, or a (substituted) phenyl and n>=1] is mixed with 1pt.wt. compound having at least one epoxy group (e.g., bisphenol A epoxy resin) and 0.05-1pt.wt. phenolic component (e.g., resorcinol).