LIGHT EMITTING AND PHOTODETECTING MODULE

PURPOSE:To eliminate the damaging of a photodetecting and light emitting element due to soldering heat by clamping and fixing the photodetecting element with a couple of rings and soldering the cylindrical part of the rear part of an optical connector to end parts of rings over the outer peripheries...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KAWAI SENJI, WATANABE SHIGEO, WATANABE MASAYUKI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PURPOSE:To eliminate the damaging of a photodetecting and light emitting element due to soldering heat by clamping and fixing the photodetecting element with a couple of rings and soldering the cylindrical part of the rear part of an optical connector to end parts of rings over the outer peripheries. CONSTITUTION:An insertion hole 29 into which the cylinder 30 of the photodetecting and light emitting element 20 is inserted is formed in the reverse surface of an external receptacle 16 and a collar part 31 formed on the bottom surface of the photodetecting and light emitting element 20 is clamped and fixed with a ring 19 having a cylindrical through hole 32 and a ring 33 having a terminal through hole 33 for the photodetecting and light emitting element. Namely, the ring 19 is pressed in the ring 21. Ring solder 17 is pressed in a cylindrical external-diameter part 35 formed to a diameter smaller than the ring 19 of the external receptacle 16 and the relative positions of the photodetecting and the light emitting element, a rod lens 18, an external receptacle 15, etc., is adjusted over a lock at a light power meter, etc.; and then heat fusing is performed by the irradiation of a near infrared ray source to solder the external diameter 35 of the external receptacle, the end surface 28 of the ring 19, and the and surface 37 of the ring 21.